High power gallium nitride electronics using miscut substrates

ABSTRACT

An electronic device includes a III-V substrate having a hexagonal crystal structure and a normal to a growth surface characterized by a misorientation from the &lt;0001&gt; direction of between 0.15° and 0.65°. The electronic device also includes a first epitaxial layer coupled to the III-V substrate and a second epitaxial layer coupled to the first epitaxial layer. The electronic device further includes a first contact in electrical contact with the substrate and a second contact in electrical contact with the second epitaxial layer.

BACKGROUND OF THE INVENTION

Power electronics are widely used in a variety of applications. Powerelectronic devices are commonly used in circuits to modify the form ofelectrical energy, for example, from ac to dc, from one voltage level toanother, or in some other way. Such devices can operate over a widerange of power levels, from milliwatts in mobile devices to hundreds ofmegawatts in a high voltage power transmission system. Despite theprogress made in power electronics, there is a need in the art forimproved electronics systems and methods of operating the same.

SUMMARY OF THE INVENTION

The present invention relates generally to electronic devices. Morespecifically, the present invention relates to the fabrication ofgallium nitride (GaN) based epitaxial layers useful for high powerelectronics. In a particular embodiment, a GaN substrate with the growthplane misoriented from the (0001) plane by less than one degree inrelation to the <1100> direction is utilized in an epitaxial growthprocess. The surface morphology and electrical properties of epitaxiallayers grown on the misoriented substrate are suitable for use in highpower electronic devices. The methods and techniques can be applied to avariety of compound semiconductor systems including diodes, FETs, andthe like.

According to an embodiment of the present invention, an electronicdevice is provided. The electronic device includes a III-V substratehaving a hexagonal crystal structure and a normal to a growth surfacecharacterized by a misorientation from the <0001> direction of between0.15° and 0.65°. The electronic device also includes a first epitaxiallayer coupled to the III-V substrate and a second epitaxial layercoupled to the first epitaxial layer. The electronic device furtherincludes a first contact in electrical contact with the substrate and asecond contact in electrical contact with the second epitaxial layer.

According to another embodiment of the present invention, a method offabricating an electronic device is provided. The method includesproviding a III-V substrate having a hexagonal crystal structure and anormal to a growth surface characterized by a misorientation from the<0001> direction of between 0.15° and 0.65°. The method also includesgrowing a first epitaxial layer coupled to the III-V substrate andgrowing a second epitaxial layer coupled to the first epitaxial layer.The method further includes forming a first contact in electricalcontact with the substrate and forming a second contact in electricalcontact with the second epitaxial layer.

Numerous benefits are achieved by way of the present invention overconventional techniques. For example, embodiments of the presentinvention provide methods and systems for fabricating epitaxial layerssuitable for use in high power electronics devices. In an embodiment,device performance during high voltage operation (e.g., voltages greaterthan 200 V) is improved in comparison with conventional designs. Theseand other embodiments of the invention, along with many of itsadvantages and features, are described in more detail in conjunctionwith the text below and attached figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified cross-sectional diagram of a high voltage PNdiode structure according to an embodiment of the present invention.

FIG. 2A is a schematic diagram illustrating Miller indices of ahexagonal-phase bulk GaN substrate wafer.

FIG. 2B is a schematic diagram showing the crystal axis directions for ac-face GaN crystal.

FIG. 2C is a schematic diagram illustrating the vector nature of themiscut angle according to an embodiment of the present invention.

FIG. 2D is a schematic diagram illustrating the radial-vector nature ofthe miscut angle according to an embodiment of the present invention.

FIG. 3A is a Nomarski micrograph of epitaxial surface, for case whensubstrate misorientation is <0.15°.

FIG. 3B is a Nomarski micrograph of epitaxial surface, for case whensubstrate misorientation is >0.65°.

FIG. 4A is a plot showing the surface morphologies of variousepitaxially grown layers mapped against substrate misorientation inorthogonal directions.

FIG. 4B is a plot showing wafer quality data as a function of miscutangle according to an embodiment of the present invention.

FIG. 5A is a plot showing the forward bias current-voltagecharacteristics of a high voltage PN diode according to an embodiment ofthe present invention.

FIG. 5B is a plot showing the reverse bias current-voltagecharacteristics of a high voltage PN diode according to an embodiment ofthe present invention.

FIG. 6 is a plot showing the reverse bias current-voltagecharacteristics of a high-voltage GaN PN diode according to anembodiment of the present invention compared to a GaN PN diodefabricated using a conventional substrate.

FIG. 7 is a simplified flowchart illustrating a method of fabricating anelectronic device according to an embodiment of the present invention.

FIGS. 8A-8B are diagrams illustrating crystal planes of Wurtzitecrystals.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

Embodiments of the present invention relate to electronic devices. Morespecifically, the present invention relates to the fabrication ofgallium nitride (GaN) based epitaxial layers useful for high powerelectronics. In a particular embodiment, a GaN substrate with the growthplane misoriented from the (0001) plane by less than one degree inrelation to the <1100> direction is utilized in an epitaxial growthprocess. The surface morphology and electrical properties of epitaxiallayers grown on the misoriented substrate are suitable for use in highpower electronic devices. The methods and techniques can be applied to avariety of compound semiconductor systems including diodes, FETs, andthe like.

GaN-based electronic and optoelectronic devices are undergoing rapiddevelopment. Desirable properties associated with GaN and related alloysand heterostructures include high bandgap energy for visible andultraviolet light emission, favorable transport properties (e.g., highelectron mobility and saturation velocity), a high breakdown field, andhigh thermal conductivity. According to embodiments of the presentinvention, gallium nitride (GaN) epitaxy on pseudo-bulk GaN substratesis utilized to fabricate vertical GaN-based semiconductor devices notpossible using conventional techniques. For example, conventionalmethods of growing GaN include using a foreign substrate such as siliconcarbide (SiC). This can limit the thickness of a usable GaN layer grownon the foreign substrate due to differences in thermal expansioncoefficients and lattice constant between the GaN layer and the foreignsubstrate. High defect densities at the interface between GaN and theforeign substrate further complicate attempts to create verticaldevices, including power electronic devices such as JFETs and otherfield-effect transistors.

Homoepitaxial GaN layers on bulk GaN substrates, on the other hand, areutilized in the embodiments described herein to provide superiorproperties to conventional techniques and devices. For instance,electron mobility, μ, is higher for a given background doping level, N.This provides low resistivity, ρ, because resistivity is inverselyproportional to electron mobility, as provided by equation (1):

$\begin{matrix}{{\rho = \frac{1}{q\;\mu\; N}},} & (1)\end{matrix}$where q is the elementary charge.

Another superior property provided by homoepitaxial GaN layers on bulkGaN substrates is high critical electric field for avalanche breakdown.A high critical electric field allows a larger voltage to be supportedover smaller length, L, than a material with a lower critical electricfield. A smaller length for current to flow together with lowresistivity give rise to a lower resistance, R, than other materials,since resistance can be determined by the equation:

$\begin{matrix}{{R = \frac{\rho\; L}{A}},} & (2)\end{matrix}$where A is the cross-sectional area of the channel or current path.

In general, a tradeoff exists between the physical dimension of a deviceneeded to support high voltage in a device's off-state and the abilityto pass current through the same device with low resistance in theon-state. In many cases GaN is preferable over other materials inminimizing this tradeoff and maximizing performance. In addition, GaNlayers grown on bulk GaN substrates have low defect density compared tolayers grown on mismatched substrates. The low defect density will giverise to superior thermal conductivity, less trap-related effects such asdynamic on-resistance, and better reliability.

FIG. 1 is a simplified cross-sectional diagram of a high voltage PNdiode structure according to an embodiment of the present invention.Referring to FIG. 1, a first gallium-nitride (GaN) epitaxial layer 115(e.g., a N⁻ GaN drift region) is formed on a GaN substrate 110 havingthe same conductivity type. The GaN substrate 110 can be a pseudo-bulkor bulk GaN material on which the first GaN epitaxial layer 115 isgrown. A buffer layer (not shown) can be utilized as will be evident toone of skill in the art. Dopant concentrations (e.g., doping density) ofthe GaN substrate 110 can vary, depending on desired functionality. Forexample, a GaN substrate 110 can have an n+ conductivity type, withdopant concentrations ranging from 1×10¹⁷ cm⁻³ to 1×10¹⁹ cm⁻³. Althoughthe GaN substrate 110 is illustrated as including a single materialcomposition, multiple layers can be provided as part of the substrate.Moreover, adhesion, buffer, and other layers (not illustrated) can beutilized during the epitaxial growth process. One of ordinary skill inthe art would recognize many variations, modifications, andalternatives.

The properties of the first GaN epitaxial layer 115 can also vary,depending on desired functionality. The first GaN epitaxial layer 115can serve as a drift region for the PN diode, and therefore can be arelatively low-doped material. For example, the first GaN epitaxiallayer 115 can have an n− conductivity type, with dopant concentrationsranging from 1×10¹⁴ cm⁻³ to 1×10¹⁸ cm⁻³. Furthermore, the dopantconcentration can be uniform, or can vary, for example, as a function ofthe thickness of the drift region.

The thickness of the first GaN epitaxial layer 115 can also varysubstantially, depending on the desired functionality. As discussedabove, homoepitaxial growth can enable the first GaN epitaxial layer 115to be grown far thicker than layers formed using conventional methods.In general, in some embodiments, thicknesses can vary between 0.5 μm and100 μm, for example. In other embodiments thicknesses are greater than 5μm. Resulting parallel plane breakdown voltages for the PN diode 100 canvary depending on the embodiment. Some embodiments provide for breakdownvoltages of at least 100V, 300V, 600V, 1.2 kV, 1.7 kV, 3.3 kV, 5.5 kV,13 kV, or 20 kV.

Referring once again to FIG. 1, a second GaN epitaxial layer 120 isformed above the first GaN epitaxial layer 201. The second GaN epitaxiallayer 120 is used in forming the p-type region of the PN diode and has aconductivity type different than the first GaN epitaxial layer 115. Forinstance, if the first GaN epitaxial layer 115 is formed from an n-typeGaN material, the second GaN epitaxial layer 120 will be formed from ap-type GaN material, and vice versa. As illustrated in FIG. 1, isolationregions are formed to define the lateral extent of the PN diode.Suitable techniques for forming the isolation regions characterized byhigh resistivity can include ion implantation, etching and epitaxialregrowth of low conductivity material, etching and deposition ofinsulating materials such as oxides and/or nitrides, combinationsthereof, or the like. One of ordinary skill in the art would recognizemany variations, modifications, and alternatives.

The thickness of the second GaN epitaxial layer 120 can vary, dependingon the process used to form the layer and the device design. In someembodiments, the thickness of the second GaN epitaxial layer 120 isbetween 0.1 μm and 5 μm. In other embodiments, the thickness of thesecond GaN epitaxial layer 120 is between 0.3 μm and 1 μm.

The second GaN epitaxial layer 120 can be highly doped, for example in arange from about 5×10¹⁷ cm⁻³ to about 1×10¹⁹ cm⁻³. Additionally, as withother epitaxial layers, the dopant concentration of the second GaNepitaxial layer 120 can be uniform or non-uniform as a function ofthickness. In some embodiments, the dopant concentration increases withthickness, such that the dopant concentration is relatively low near thefirst GaN epitaxial layer 115 and increases as the distance from thefirst GaN epitaxial layer 115 increases. Such embodiments provide higherdopant concentrations at the top of the second GaN epitaxial layer 120where metal contacts can be subsequently formed. Other embodimentsutilize heavily doped contact layers (not shown) to form ohmic contacts.

One method of forming the second GaN epitaxial layer 120, and otherlayers described herein, can be through a regrowth process that uses anin-situ etch and diffusion preparation processes. These preparationprocesses are described more fully in U.S. patent application Ser. No.13/198,666, filed on Aug. 4, 2011, the disclosure of which is herebyincorporated by reference in its entirety.

FIG. 1 also illustrates electrical contacts formed for the electronicdevice according to an embodiment of the present invention. Asillustrated in FIG. 1, a metallic structure 135 is formed in electricalcontact with the GaN substrate 110. The metallic structure 135 can beone or more layers of ohmic metal that serve as a contact for thecathode of the PN diode 100. For example, the metallic structure 135 cancomprise a titanium-aluminum (Ti/Al) ohmic metal. Other metals and/oralloys can be used including, but not limited to, aluminum, nickel,gold, combinations thereof, or the like. In some embodiments, anoutermost metal of the metallic structure 135 can include gold,tantalum, tungsten, palladium, silver, or aluminum, combinationsthereof, and the like. The metallic structure 135 can be formed usingany of a variety of methods such as sputtering, evaporation, or thelike.

FIG. 1 also illustrates an additional metallic structure 130 inelectrical contact with the second epitaxial layer 120. The additionalmetallic structure 130 can be one or more layers of ohmic metalincluding metals and/or alloys similar to the metallic structure 135.The additional metallic structure 130 is formed on the second epitaxiallayer 120 to serve as the anode contact of the PN diode 100. Theadditional metallic structure 130 can be formed using a variety oftechniques, including lift-off and/or deposition with subsequentetching, which can vary depending on the metals used. Example metalsinclude nickel-gold (Ni/Au), and the like. In some implementations, theadditional metallic structure 130 is formed in contact with the firstepitaxial layer and a Schottky metal is utilized as appropriate to theformation of a Schottky diode.

Different dopants can be used to create n- and p-type GaN epitaxiallayers and structures disclosed herein. For example, n-type dopants caninclude silicon, oxygen, or the like. P-type dopants can includemagnesium, beryllium, calcium zinc, or the like.

Although some embodiments are discussed in terms of GaN substrates andGaN epitaxial layers, the present invention is not limited to theseparticular binary III-V materials and is applicable to a broader classof III-V materials, in particular III-nitride materials. Additionally,although a GaN substrate is illustrated in FIG. 1, embodiments of thepresent invention are not limited to GaN substrates. Other III-Vmaterials, in particular, III-nitride materials, are included within thescope of the present invention and can be substituted not only for theillustrated GaN substrate, but also for other GaN-based layers andstructures described herein. As examples, binary III-V (e.g.,III-nitride) materials, ternary III-V (e.g., III-nitride) materials suchas InGaN and AlGaN, quaternary III-nitride materials, such as AlInGaN,doped versions of these materials, and the like are included within thescope of the present invention.

The fabrication process discussed in relation to FIG. 1 utilize aprocess flow in which an n-type drift layer is grown using an n-typesubstrate. However, the present invention is not limited to thisparticular configuration. In other embodiments, substrates with p-typedoping are utilized. Additionally, embodiments can use materials havingan opposite conductivity type to provide devices with differentfunctionality. Thus, although some examples relate to the growth ofn-type GaN epitaxial layer(s) doped with silicon, in other embodimentsthe techniques described herein are applicable to the growth of highlyor lightly doped material, p-type material, material doped with dopantsin addition to or other than silicon such as Mg, Ca, Be, Ge, Se, S, O,Te, and the like. The substrates discussed herein can include a singlematerial system or multiple material systems including compositestructures of multiple layers. One of ordinary skill in the art wouldrecognize many variations, modifications, and alternatives.

During the growth of the epitaxial layers illustrated in FIG. 1, theinventors have determined that epitaxial layers grown on substratescharacterized by predetermined miscut angles provide improvedperformance in the context of high power electronic devices (e.g.,operation at high voltages) in comparison with conventional structures.For epitaxial layers grown on the c-plane of a GaN substrate, the layermorphology, and importantly, the performance of devices formed usingthese epitaxial layers, degrades at higher voltages, reducing theirapplicability to high power applications. The inventors have determinedthat, without limiting embodiments of the present invention,misorientation of the substrate growth surface from the crystallographicplanes (e.g., the c-plane) by a fraction of a degree in a predetermineddirection, improves layer morphology and device performance for devicesfabricated using such improved layers.

FIGS. 8A-8B are diagrams illustrating crystal planes of Wurtzitecrystals. In FIG. 8A, the a-planes of a Wurtzite crystal are illustratedand in FIG. 8B, the m-planes of a Wurtzite crystal are illustrated. Thec-axis (0001) is normal to the plane of the figures and the (000-1) axispoints into the plane of the figures. As illustrated in FIG. 8A, thereare six a-planes, all 60° apart. As illustrated in FIG. 8B, there aresix m-planes, all 60° apart. When overlaid, the m- and a-planesinterpenetrate, an angle of 30° between these planes. As will be evidentto one of skill in the art, GaN has a Wurtzite crystalline structure.

FIG. 2A is a schematic diagram illustrating Miller indices of ahexagonal-phase bulk GaN substrate wafer. The dashed arrows indicate thedirection of the <0001>, <1100>, and <1120> directions. The solid arrow210 indicates the direction of misorientation with respect to the <1100>direction utilized for the epitaxial growth of the high-voltageelectronic device structures described according to some embodimentsherein. As illustrated in FIG. 2A, embodiments of the present inventionutilize substrates in which the growth plane is not aligned with the(0001) plane. As described herein, the normal to the growth plane ismisoriented from the <0001> direction (i.e., a misorientation angle (θ))by 0<θ<1.0° towards the −<1100> direction or the <1100> direction.According to some embodiments of the present invention, the magnitude ofθ ranges from about 0.15°<θ<0.65°. In a particular embodiment, themisorientation angle θ ranges from about is about 0.4°<θ<0.5°.

Thus, according to embodiments of the present invention, the growthplane of the III-V (e.g., GaN) substrate is misoriented from the c-planetowards the positive or negative m-direction at an angle having a valuebetween zero and 1.0°. Additionally, the normal to the substrate growthsurface can also be misoriented such that it also tilts towards or awayfrom the a-direction. The misorientation away from the <0001> directiontowards the a-direction is zero in some embodiments. In the embodimentillustrated in FIG. 2A, the normal to the growth surface ischaracterized by a misorientation from the <0001> direction toward the<1100> direction of between −0.15° and −0.65° and a misorientation fromthe <0001> direction toward the <1120> direction of zero.

In some embodiments, the orientation of the growth surface is such thatthe growth surface is tilted with respect to the (0001) plane, resultingin the normal to the growth surface being titled by less than one degreetoward the positive <1100> direction. The inventors have determined thattilting of the growth surface by misorientation away from the (0001)surface towards the negative m-direction by between 0.15° and 0.65° ortowards the positive m-direction by between 0.15° and 0.65° results inimprovements in the surface morphology for thick epitaxial layers anddevice performance accordingly. Thus, embodiments of the presentinvention provide growth surfaces tilted with respect to the (0001)surface by an angle greater than 0.15° and less than one degree. One ofordinary skill in the art would recognize many variations,modifications, and alternatives.

FIG. 2B is a schematic diagram illustrating miscut angles according toan embodiment of the present invention. The solid arrows are associatedwith a-planes and the dashed arrows are associated with m-planes. Forthis diagram, the c-axis is normal to the plane of the figure. Accordingto embodiments of the present invention, for the GaN wafer, the c-planeis (nearly) normal to wafer surface, so that the m-directions anda-directions are oriented as illustrated in FIG. 2B. It should be notedthat the example illustrated in FIG. 2B utilizes one axis convention,but other axis conventions can be utilized, including an axis conventionthat is rotated 180° relative to the wafer flat. Both conventions aresymmetrically equivalent.

The miscut target direction 250 is pointed towards the left (parallel toflat) for each of the axis conventions. The predetermined specificationwindow 251 can be represented as a box that is centered on anm-direction, but also includes a-directions. For the illustrated axisconvention, the miscut target is along [−1100]. For the alternative axisconvention that is rotated 180° relative to the wafer flat, the miscuttarget is along [1-100]. Therefore, for both conventions, if the flat ison the bottom side, both miscut targets point to the left.

FIG. 2C is a schematic diagram illustrating the vector nature of themiscut angle according to an embodiment of the present invention. Asillustrated in FIG. 2C, the miscut angle R is a vector quantity, definedby components in the m- and a-directions. Both can vary independentlyacross a wafer, and may have different effects. Physically, this vectorcan be considered as the crystallographic c-direction projected onto theplane defined by the surface of the wafer, as shown by the square region250.

FIG. 2D is a schematic diagram illustrating an alternative specificationfor miscut angle according to an embodiment of the present invention. InFIG. 2D, the miscut specification 260, rather than being specified bythe miscut angle with respect to the m-plane and a-plane components,could be specified by the magnitude |R| and the direction θ of themiscut angle, as shown by region 260.

FIG. 3A is a Nomarski micrograph of epitaxial surface, for case whensubstrate misorientation is <0.15°. FIG. 3B is a Nomarski micrograph ofepitaxial surface, for case when substrate misorientation is >0.65°. Asillustrated in FIG. 3A, the surface morphology of epitaxial layers grownon a substrate having a misorientation less than 0.15° is characterizedby large hexagonal hillocks, with lateral dimensions on the order oftens to hundreds of microns and heights of up to several microns. Theinventors believe that the lateral dimensions of the hillocks increasesas the thickness of the epitaxial layers increases. Referring to FIG.3B, the surface morphology of epitaxial layers grown on a substratehaving a misorientation greater than 0.65° is characterized by ascalloped surface, which can also be referred to as a ridged orfish-scale surface, with lateral and vertical dimensions on the order ofup to several microns. For both of these substrate misorientation valuesoutside the range included within the scope of the present invention,devices fabricating using epitaxial layers grown on these substrates,are characterized by undesirable levels of device leakage duringoperation in high power regimes.

As described in additional detail in relation to FIG. 4A, the inventorshave determined that a strong correlation exists between the substratemisorientation, the surface morphology, and the high power deviceperformance. For substrate misorientations of ˜0.4° to 0.5° from them-direction, good surface morphology results, producing devices thathave improved high power operating characteristics.

FIG. 4A is a plot showing the surface morphologies of variousepitaxially grown layers mapped against substrate misorientation inorthogonal directions (i.e., the <1100> and <1120> directions). Thevertical axis represents the miscut angle in degrees toward thea-direction (towards <1120>). The horizontal axis represents the miscutangle toward the m-direction (towards <1100>). As illustrated in FIG. 3,good morphology for the epitaxial layers (solid black circles) resultswhen the miscut angle (θ) is in vicinity of zero miscut toward thea-direction and ˜0.35°-˜0.55° degrees miscut toward the m-direction. Ina particular embodiment, a miscut angle toward the m-direction ofbetween −0.4°-0.5° is utilized.

It should be noted that holding the miscut angle of the substratetowards the a-direction at substantially zero degrees, good surfacemorphology can be obtained. Referring to FIG. 4A, it should also benoted that good surface morphology can also be obtained by adjustingboth the misorientation with respect to the a-direction and them-direction. As illustrated by the poor surface morphology fora-direction=−0.13° and m-direction=−0.33° (data point 421) and the goodsurface morphology obtained for miscut towards the a-direction by −0.13°and m-direction=−0.43° (data point 423), the increase in the absolutevalue of the miscut angle in the m-direction will also result in goodsurface morphology. Thus, variation in the miscut angle with respect tothe a-direction can be compensated for by variation in the miscut anglewith respect to the m-direction. One of ordinary skill in the art wouldrecognize many variations, modifications, and alternatives.

Referring to FIG. 4A, 70 data points are illustrated, representing fivepoints measured on 14 GaN substrates. Data provided in relation to thefive points on each substrate included the miscut information. Themiscut specification for these wafers was miscut toward the m-directionof −0.4° and miscut toward the a-direction of 0°, both with a tolerance±0.3°. The five points were imaged using Nomarski microscopy and judgedto be Good (solid circles), Bad (x) or Borderline (open circles). TheGood morphologies were obtained for miscut towards the a-direction closeto 0° and miscut toward the m-direction of ˜−0.4°-−0.5°. Thus, asdemonstrated by the data, a miscut with respect to the <0001> directionof less than −0.3° toward the m-direction results in poor morphology.Additionally, at high miscut angles (i.e., greater than ±0.6 withrespect to the <0001> direction results in poor morphology.

Given the manufacturing tolerances and variation in crystal surfaceorientation across the wafer, embodiments of the present inventionutilize a target miscut value that produces the largest possible area ofmaterial with good surface morphology (and consequent high deviceyield). As illustrated in FIG. 4A and discussed above, a larger miscuttowards the m-direction can accommodate some variation in miscut towardsthe a-direction. Referring to FIG. 4A, an a-direction miscut of −0.13°is represented by the horizontal dashed line. For this value ofa-direction miscut, an m-direction miscut of less than 0.35° producespoor morphology, while a greater m-direction miscut results in goodmorphologies. In this manner, the m-direction and a-direction miscutsinteract to affect the morphology, and a larger m-direction miscut canbe utilized to accommodate variation in a-direction miscut.

It should be noted that although the substrate specifications mayspecify a particular miscut orientation for the substrate, the variationin orientation across the substrate may result in some regions of thesubstrate being characterized by a misorientation within the rangesprovided by embodiments of the present invention and other regionscharacterized by a misorientation outside the ranges provided byembodiments of the present invention. In other words, substratemanufacturers allow for some margin in miscut variation. The variationin miscut tends to be relatively large for pseudo-bulk GaN grown by HVPEon non-native substrates. Therefore the surface morphology will varyaccordingly across the wafer, as indicated the data in FIG. 4A.

As an example, if the substrate specification is for a misorientationtoward the m-direction of 0.3°±0.3°, then regions of the substrate canbe characterized by zero misorientation while other regions arecharacterized by a misorientation of 0.6°. The inventors have determinedthat, for substrates with varying misorientation angles, the morphologyis good in regions with a misorientation angle within the ranges of theembodiments described herein, which can be correlated to improved deviceperformance.

FIG. 4B is a plot showing wafer quality data as a function of miscutangle according to an embodiment of the present invention. The waferquality data was measured based on Nomarski images taken from wafersgrown with various miscut angles. Each point represents a vector,beginning at the origin and ending at the datapoint. Wafers with “Good”quality are indicated by diamond symbols, wafers with “Bad” quality areindicated by square symbols, and wafers with borderline quality areindicated by triangle symbols. By considering the miscut toward thea-direction, the inventors have determined that poor morphology may berelated to miscut angle as well as to the magnitude.

FIG. 5A is a plot showing the forward bias current-voltagecharacteristics of a high voltage PN diode according to an embodiment ofthe present invention. FIG. 5B is a plot showing the reverse biascurrent-voltage characteristics of a high voltage PN diode according toan embodiment of the present invention. As illustrated in FIG. 5A, thePN diode turns on at ˜3V with a substantially linear I-V characteristic.Referring to FIG. 5B, under reverse bias, the PN diode conductssubstantially no current until the voltage reaches ˜2,500 V, at whichbreakdown occurs. Thus, embodiments of the present invention aresuitable for high voltage (e.g., greater than 400 V) operation.

FIG. 6 is a plot showing the reverse bias current-voltagecharacteristics of a high-voltage GaN PN diode according to anembodiment of the present invention (solid curve) compared to a GaN PNdiode fabricated using a conventional substrate, which can includesubstrates that are cut at misorientation angles (θ) outside of theranges suitable for use according to embodiments of the presentinvention.

As illustrated in FIG. 6, under reverse bias, the reverse leakagecurrent is substantially the same up to voltages of ˜700 V. At reversebias voltages over 700 V, although the high voltage PN diode fabricatedaccording to embodiments of the present invention maintains asubstantially linear increase in reverse leakage current with voltage(plotted on a logarithmic scale). Thus, in devices, for example, PNdiodes, Schottky diodes, vertical JFETs, HEMTs, integrated FETs anddiodes, merged PN/Schottky diodes, and the like, that operate at highvoltages, e.g., >600 V, >1200 V, >1700 V, or the like, the use ofsubstrates with a predetermined misorientation angle provide improvedperformance, particularly in high voltage regimes.

It should be noted that embodiments of the present invention areparticularly suitable for applications in high power regimes. For lowpower regimes, associated with some LED and laser operation, and otherforward bias operation, or the like, the impact of the substrate notbeing miscut within the predetermined range provided by embodiments ofthe present invention would not be detectable, since, as illustrated inFIG. 6, effects dependent on the proper miscut angle are not observablein some implementations until high power regimes are entered. Thus,embodiments of the present invention are suitable for deviceapplications utilizing thick epitaxial layers (e.g., a drift layer >3 μmthick) that are operated in high power regimes (e.g., >200 V). Sinceconventional GaN devices operate in low power regimes (e.g., less than200 V), the impact of the proper misorientation of the substrate wouldnot have been observed during typical operation. The inventors, on thecontrary, have appreciated the scope of the problem presented bysubstrates oriented at conventional orientations during operating inhigh power regimes. Thus, embodiments of the present invention areparticularly applicable to devices in which one or more of the epitaxiallayers are characterized by low doping and high thickness, for example,the drift layer of a vertical PN GaN diode. Thus, embodiments of thepresent invention are particularly suitable for devices that includeepitaxial layers over 5 μm in thickness.

FIG. 7 is a simplified flowchart illustrating a method of fabricating anelectronic device according to an embodiment of the present invention.Referring to FIG. 7, the method includes providing a III-V substratehaving a hexagonal crystal structure and a normal to a growth surfacecharacterized by a misorientation from the <0001> direction of between0.15° and 0.65° (710). The III-V substrate is an n-type GaN substrate ina specific embodiment. In an embodiment, the normal to the growthsurface is misoriented towards toward the negative <1100> direction, forexample, in a range of between 0.4° and 0.5°. In a particularembodiment, the normal to the growth surface is characterized by amisorientation towards the <1120> direction of substantially zerodegrees. In other embodiments, the misorientation has componentstoward/away from both the <1100> direction and the <1120> direction.

The method also includes growing a first epitaxial layer coupled to theIII-V substrate (712) and growing a second epitaxial layer coupled tothe first epitaxial layer (714). For some devices, the method includesforming an isolation region disposed laterally to the second epitaxiallayer. In some high power device applications, the first epitaxial layercomprises an n-type GaN epitaxial layer having a thickness greater than3 μm and the second epitaxial layer comprises a p-type GaN epitaxiallayer. In some implementations, the method also includes forming a thirdepitaxial layer disposed between the second epitaxial layer and thesecond contact. A doping density of the third epitaxial layer is higherthan a doping density of the second epitaxial layer.

Additionally, the method includes forming a first contact in electricalcontact with the substrate (716) and forming a second contact inelectrical contact with the second epitaxial layer (718). As anexemplary device, a PN diode can be fabricated using the techniquesdescribed herein, with the first contact being a cathode and the secondcontact being an anode of the PN diode. The electronic device can alsobe a Schottky diode.

It should be appreciated that the specific steps illustrated in FIG. 7provide a particular method of fabricating an electronic deviceaccording to an embodiment of the present invention. Other sequences ofsteps may also be performed according to alternative embodiments. Forexample, alternative embodiments of the present invention may performthe steps outlined above in a different order. Moreover, the individualsteps illustrated in FIG. 7 may include multiple sub-steps that may beperformed in various sequences as appropriate to the individual step.Furthermore, additional steps may be added or removed depending on theparticular applications. One of ordinary skill in the art wouldrecognize many variations, modifications, and alternatives.

It is also understood that the examples and embodiments described hereinare for illustrative purposes only and that various modifications orchanges in light thereof will be suggested to persons skilled in the artand are to be included within the spirit and purview of this applicationand scope of the appended claims.

What is claimed is:
 1. An electronic device comprising: a III-Vsubstrate having a hexagonal crystal structure and a normal to a growthsurface characterized by a misorientation from the <0001> direction ofbetween 0.15° and 0.65°; a first III-V epitaxial layer coupled to theIII-V substrate; a second III-V epitaxial layer coupled to the firstIII-V epitaxial layer; a first contact in electrical contact with theIII-V substrate; and a second contact in electrical contact with thesecond III-V epitaxial layer.
 2. The electronic device of claim 1wherein the normal to the growth surface is misoriented towards thenegative <1100> direction.
 3. The electronic device of claim 1 whereinthe misorientation is between 0.4° and 0.5°.
 4. The electronic device ofclaim 1 wherein the normal to the growth surface is characterized by amisorientation towards the <1120> direction of substantially zerodegrees.
 5. The electronic device of claim 1 wherein the normal to thegrowth surface is misoriented towards the <1100> direction by an angleranging between −0.4° and −0.5° and towards the <1120> direction by anangle ranging between −0.1° and −0.2°.
 6. The electronic device of claim1 wherein the III-V substrate comprises an n-type GaN substrate.
 7. Theelectronic device of claim 1 wherein the first III-V epitaxial layercomprises an n-type GaN epitaxial layer and the second III-V epitaxiallayer comprises a p-type GaN epitaxial layer.
 8. The electronic deviceof claim 1 wherein the electronic device comprises a PN diode, the firstcontact comprises a cathode of the PN diode, and the second contactcomprises an anode of the PN diode.
 9. The electronic device of claim 1further comprising an isolation region disposed laterally to the secondIII-V epitaxial layer.
 10. The electronic device of claim 1 furthercomprising a third III-V epitaxial layer disposed between the secondIII-V epitaxial layer and the second contact, wherein a doping densityof the third III-V epitaxial layer is higher than a doping density ofthe second III-V epitaxial layer.